TAIPEI (Reuters) -The governor of the U.S. state of Arizona said on Tuesday that the state was in talks with Taiwanese chipmaker TSMC on advanced packaging.

In July, TSMC said production at its first chip fabrication facility, or fab, in Arizona would be delayed until 2025 due to a shortage of specialist workers, and it was sending technicians from Taiwan to train local staff. Production had been due to start next year.

TSMC is investing $40 billion in the project, supporting Washington’s plans for more chipmaking at home.

Speaking during a visit to Taipei, Governor Katie Hobbs said the TSMC factory project in Arizona was going well and she was very impressed by the speed with which it has been built.

Hobbs said she had met TSMC executives on Monday.

“We talked about our continued partnership, their investments in Arizona, how we can continue to address any issues that come up,” she said.

“The project is going well in Arizona, I’m very impressed by the speed with which it’s been built and we are working through bugs and expect it to continue on schedule.”

Taiwan Semiconductor Manufacturing Co Ltd, the world’s largest contract chipmaker, counts Apple and Nvidia among its major clients.

(Reporting by Sarah Wu; Writing by Ben Blanchard; Editing by Muralikumar Anantharaman and Edmund Klamann)

Brought to you by